The life of a semiconductor component is prolonged for many years under normal use.But
it is inadvisable to wait until a few years later to study components.The applied stress
should be increased,which can strengthen or speed up the potential failure mechanism
and help to find out the root cause.In semiconductor components,some common
acceleration factors are temperature,humidity.voltage,and current.In most cases,an
accelerated test does not change the physical characteristics of the fault,but it will change
the observation time.The change between the acceleration condition and normal use
condition is called "derating".
The highly accelerated test is the key part of the qualification test based on JEDEC.If a
product passes these tests,it means that the component can be used in most cases.
The test capabilities of JieJie Microelectronics Laboratory are listed below.
Test items
Test standards
Application of stress/accelerator
Test purpose
Pretreatment (PRE)
JESD22-A113
Temperature and humidity
Simulate the effects of changing environments, including rising temperature and humidity, during transportation, storage and circuit board assembly.
Moisture sensitivity level (MSL)
IPC/JEDEC J-STD-020
Temperature and humidity
Ascertain the classification level of unsealed surface mount devices (SMDs) sensitive to moisture-induced stress, so that they can be packaged, stored and processed properly to avoid spoilage during reflow soldering connection for assembly and/or repair
Temperature shock test (TCT)
JESD22-A104
Change rate of temperature and humidity
Evaluate the product's ability to withstand alternating high and low temperature extremes
Unbiased highly accelerated stress test (UHAST)
JESD22-A118
Temperature, humidity, and pressure
Evaluation of moisture resistance of unsealed packaged devices without bias voltage
Highly accelerated stress test (HAST)
JESD22-A110
Temperature, humidity, voltage and pressure
Evaluate the moisture resistance of unsealed packaged devices with bias voltage
Pressure cooker test (PCT)
JESD22-A102
Temperature, humidity, and pressure
Evaluate the moisture resistance of package
Accelerated temperature and humidity test (THT)
JESD22-A101
Temperature and humidity
Evaluate the ability of the product to withstand humidity and temperature stress for a long time
High-temperature storage test (HTST)
GB/T 2423.2
Temperature
Evaluate the ability of the product to withstand high temperature stress for a long time
Low-temperature storage test (LTST)
GB/T 2423.1
Temperature
Evaluate the ability of the product to withstand low temperature stress for a long time
Solderability (SD)
EIA/IPC/JEDEC J-STD-002
Temperature
Evaluate the solderability of the product
Salt spray test (SST)
GB/T.2423.17
Acid corrosion
Evaluate the salt spray corrosion resistance of products or metallic materials
High temperature reverse bias test
JESD22-A108
Temperature and voltage
Determine the effect of bias conditions and temperature on solid-state devices with time.
High temperature grid bias test (HTGB)
JESD22-A108
Temperature and voltage
Determine the effect of bias conditions and temperature on solid-state devices with time.
High-temperature high-humidity reverse bias test (H3TRB)
JESD22-A101
Temperature, humidity and voltage
Simulate the resistance of the device to moisture under conditions of high temperature, high humidity and bias voltage
Intermittent operation life at high temperature (IOL)
MIL-STD-750
Method 1037
Temperature and voltage
Evaluate the reliability of the product during repeated on-off cycles
Vibration test - VVF
JEDEC JESD2-B-103
Acceleration
Evaluate whether the product can withstand the test of vibration environment during transportation or operation within its life cycle
ESD(HBM/MM/CDM)
AEC-Q101-001
AEC-Q101-002
AEC-Q101-005
Voltage
Evaluate antistatic effect of the product: Simulate the behavior of human body releasing the accumulated electrostatic charge to the ground through the device; simulate the charging and discharging events in production equipment and processes
