Component failure refers to the complete or partial loss of its function,parameter drift,or
intermittent occurrence of the above situations.The failure mode is the external
macroscopic manifestation of a product failure,including open circuit,short circuit,on and
off at times,abnormal function,and parameter drift.According to the failure mechanism,
failures can be divided into structural,thermal,electrical,and corrosion failures.Failure
analysis method:
(1)Non-destructive analysis:X-ray fluoroscopy,ultrasonic scanning,electrical
performance test,morphology test,and local composition analysis
(2)Destructive analysis:opening inspection,profile analysis,probe test,thermal
performance test,overall composition test,etc.
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Electronic microscope
Checks the appearance,cracks, pollution,scratches,defects of the oxide layer,etc.
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X-ray detector
Checks bonding wires,chip connections and lead frames, voids and bubbles,etc.
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Ultrasonic scanning
Checks the appearance,cracks, pollution,scratches,defects of the oxide layer,etc.
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Scanning electron microscope and energy spectrum analysis
Checks the appearance,cracks, pollution,scratches,defects of the oxide layer,etc.
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lon grinder
Finely machine of mechanical
polishing of samples,tiny
cracks,and voids
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Hot spot location
analvsis svstem
Detects the abnormal leakage failure point of the chip surface and the abnormal short circuit point of the sample.
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Laser cap opener
Finely machine of mechanical polishing of samples,tiny cracks,and voids
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Slice grinder
Detects the abnormal leakage failure point of the chip surface and the abnormal short circuit point of the sample.
